Norris-Landzberg-Exponential Model
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Validate calculation of Norris-Landzberg relationship (can be done using the GLL model in ALTA with proper transformation for each stress).
Reference Case
Data is from Example 7.2 on page 257 in book Life Cycle Reliability Engineering by Dr. Guangbin Yang, John Wiley & Sons, 2007.
Data
The thermal cycling profiles and test results for chip-scale package solder joints are given below. A thermal cycling profile can be represented by 3 independent stresses in Norris-Landzberg relationship. They are the maximum temperature , the temperature difference , and cycling frequency .
| Failure Time | T Max (°C) | Delta T(°C) | f |
|---|---|---|---|
| 208 | 80 | 120 | 1 |
| 225 | 80 | 120 | 2 |
| 308 | 80 | 120 | 3 |
| 142 | 100 | 140 | 2 |
| 108 | 120 | 160 | 2 |
| 169 | 100 | 120 | 2 |
| 131 | 120 | 120 | 2 |
| 1300 | 80 | 50 | 2 |
| 650 | 100 | 70 | 2 |
| 258 | 120 | 90 | 2 |
| 6231 | 30 | 50 | 2 |
| 1450 | 30 | 70 | 2 |
Result
Results in ALTA