Norris-Landzberg-Exponential Model: Difference between revisions
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The following table shows the thermal cycling profiles and test results for chip-scale package solder joints. In this example, the thermal cycling profile is represented by three independent stresses. These are: maximum temperature (<math>\,\!T_{Max}</math>), temperature difference (<math>\,\!\Delta T</math>) and cycling frequency (<math>\,\!f</math>). | The following table shows the thermal cycling profiles and test results for chip-scale package solder joints. In this example, the thermal cycling profile is represented by three independent stresses. These are: maximum temperature (<math>\,\!T_{Max}</math>), temperature difference (<math>\,\!\Delta T</math>) and cycling frequency (<math>\,\!f</math>). | ||
{| {{table|50%}} | {| {{table|50%}} | ||
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{{Reference_Example_Heading3}} | {{Reference_Example_Heading3}} | ||
The book uses a multiple linear regression model to analyze the data set. The model parameters are estimated using the least squares method. The regression model is shown next: | |||
::<math>\begin{align}\\ | ::<math>\begin{align}\\ | ||
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{{Reference_Example_Heading4|ALTA}} | {{Reference_Example_Heading4|ALTA}} | ||
In ALTA, the | In ALTA, we use the general log-linear life-stress relationship with the exponential distribution (GLL-exponential model). The following picture shows the proper transformation for each stress. | ||
[[image:Norris-Landzberg Exp_Stress Transform.png|center]] | [[image:Norris-Landzberg Exp_Stress Transform.png|center]] | ||
The following picture shows the results in ATLA. Note that ALTA uses maximum likelihood estimation to estimate the parameters; therefore, the results are close to, but not exactly the same, as the results given in the book, where the least squares method is used. | |||
[[image:Norris-Landzberg Exp_Analysis Summary.png|center]] | [[image:Norris-Landzberg Exp_Analysis Summary.png|center]] |
Revision as of 15:19, 13 June 2014
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