Norris-Landzberg-Exponential Model: Difference between revisions
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The thermal cycling profiles and test results for chip-scale package solder joints are given below. A thermal cycling profile can be represented by 3 independent stresses in Norris-Landzberg relationship. They are the maximum temperature (<math>\,\!T_{Max}</math>), the temperature difference (<math>\,\!\Delta T</math>) and cycling frequency (<math>\,\!f</math>). | The thermal cycling profiles and test results for chip-scale package solder joints are given below. A thermal cycling profile can be represented by 3 independent stresses in Norris-Landzberg relationship. They are the maximum temperature (<math>\,\!T_{Max}</math>), the temperature difference (<math>\,\!\Delta T</math>) and cycling frequency (<math>\,\!f</math>). | ||
{| {{table}} | {| {{table|50%}} | ||
!Failure Time | !Failure Time | ||
!T<sub>MAX</sub> (°C) | !T<sub>MAX</sub> (°C) | ||
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!f | !f | ||
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Revision as of 21:15, 10 June 2014
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