For this data set, a multiple linear regression model is used in the book. The model parameters are estimated using the least squared estimation. The regression model is
{{Reference_Example_Heading4|ALTA}}
{{Reference_Example_Heading4|ALTA}}
In ALTA, the General Log-linear model is used with the proper transformation for each stress. The failure time distribution is Exponential.
Validate calculation of Norris-Landzberg relationship (can be done using the GLL model in ALTA with proper transformation for each stress).
Reference Case
Data is from Example 7.2 on page 257 in book Life Cycle Reliability Engineering by Dr. Guangbin Yang, John Wiley & Sons, 2007.
Data
The thermal cycling profiles and test results for chip-scale package solder joints are given below. A thermal cycling profile can be represented by 3 independent stresses in Norris-Landzberg relationship. They are the maximum temperature , the temperature difference , and cycling frequency .
Failure Time
T Max (°C)
Delta T(°C)
f
208
80
120
1
225
80
120
2
308
80
120
3
142
100
140
2
108
120
160
2
169
100
120
2
131
120
120
2
1300
80
50
2
650
100
70
2
258
120
90
2
6231
30
50
2
1450
30
70
2
Result
For this data set, a multiple linear regression model is used in the book. The model parameters are estimated using the least squared estimation. The regression model is
Results in ALTA
In ALTA, the General Log-linear model is used with the proper transformation for each stress. The failure time distribution is Exponential.
