Norris-Landzberg-Exponential Model: Difference between revisions
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(Created page with '{{Reference Example|ALTA_Reference_Examples_Banner.png|ALTA_Reference_Examples}} Validate calculation of Norris-Landzberg relationship (can be done using the GLL model in ALTA w…') |
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The thermal cycling profiles and test results for chip-scale package solder joints are given below. A thermal cycling profile can be represented by 3 independent stresses in Norris-Landzberg relationship. They are the maximum temperature , the temperature difference , and cycling frequency . | |||
{| {{table}} | |||
!Failure Time | |||
!T Max (°C) | |||
!Delta T(°C) | |||
!f | |||
|- | |||
| 208||80||120||1 | |||
|- | |||
| 225||80||120||2 | |||
|- | |||
| 308||80||120||3 | |||
|- | |||
| 142||100||140||2 | |||
|- | |||
| 108||120||160||2 | |||
|- | |||
| 169||100||120||2 | |||
|- | |||
| 131||120||120||2 | |||
|- | |||
| 1300||80||50||2 | |||
|- | |||
| 650||100||70||2 | |||
|- | |||
| 258||120||90||2 | |||
|- | |||
| 6231||30||50||2 | |||
|- | |||
| 1450||30||70||2 | |||
|} | |||
{{Reference_Example_Heading3}} | {{Reference_Example_Heading3}} | ||
{{Reference_Example_Heading4|ALTA}} | {{Reference_Example_Heading4|ALTA}} |
Revision as of 23:28, 9 June 2014
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