ALTA ALTA Standard Folio Data Eyring-Lognormal: Difference between revisions

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The Eyring relationship was formulated from quantum mechanics principles and is most often used when thermal stress (temperature) is the acceleration variable. However, the Eyring relationship is also often used for stress variables other than temperature, such as humidity.
The Eyring relationship was formulated from quantum mechanics principles and is most often used when thermal stress (temperature) is the acceleration variable. However, the Eyring relationship is also often used for stress variables other than temperature, such as humidity.
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Revision as of 03:46, 26 July 2012

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Standard Folio Eyring-Lognormal

The Eyring relationship was formulated from quantum mechanics principles and is most often used when thermal stress (temperature) is the acceleration variable. However, the Eyring relationship is also often used for stress variables other than temperature, such as humidity.




















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